PCB Making Machine Double Platform Induction Bonding Machine PCB Bonding Machine

Basic Info.Model NO.XJ-712After-sales ServiceSupportWarranty1 YearWeight600kgFreezing Method:Cooled at Room TemperatTrademarkKEXINSpecification2095mm*1455mm*1760mmOriginChinaProduct DescriptionXJ-712 Automatic Perfect Binding Machine Double Platform Bonding Machine for PCBEquipment modelXJ-712Size2095mm*1455mm*1760mm (L*W*H)Plate sizeMinimum size 350mm*390mm, maximum size 680mm*780mm, can be customized according to demandPlate thickness0.2mm - 10mmHot melt methodHigh-frequency electromagnetic inductionHot melt parametersTemperature 50°C - 350°CInput power380V/3PH/2KWInput air supply8mm tubing, 6-7 bar, 200 L/minEquipment features:• Rapid heating by high-frequency electromagnetic induction• 12 hot melting points• Double table design, PIN positioning• Stacked countertops have a pressure plate design• Programming of production parameters Introduction to electromagnetic heating• Using the principle of electromagnetic induction heating, the hot melt area and semi-curing of each inner plate are fused together, replacing the traditional electric heating and rivet fixing methods• Electromagnetic heating is a new, safe, efficient and energy-saving heating method• Heats up faster than conventional electric heating,• High temperature control accuracy,• Thermal efficiency up to more than 90%.• Uniform heating, independent of plate thickness