High Quality Laser Engraving Cutting Machine

  Laser glass cutting machinePrinciples and advantages of laser cutting  How is laser cutting achieved?Laser generates ultra short pulses with extremely high energy and interacts with the workpiece in an extremely short time. When the beam propagates and acts in the material, it will damage its stress structure and form micrometer sized wire holes. By optimizing the spacing between holes, microcracks are formed, and cutting is achieved in conjunction with the splitting process.advantage1.The overall automation level of the equipment is high (cutting and splitting can be integrated), with low power consumption and simple operation.2.Laser technology, due to its non-contact processing characteristics, can complete processes that cannot be achieved by traditional methods.3.Consumable free processing, low operating costs, and more environmentally  friendly.4.High precision, no taper, no secondary damage to the workpiece.  The principle and advantages of laser drillingHow is laser drilling achieved?The laser beam focuses the spot at an appropriate position based on the thickness of the workpiece, scans and moves at high speed on the workpiece according to the preset path, and interacts with the workpiece under the action of the high-energy laser beam, peeling the target area layer by layer to form a cutting path, achieving the detachment of the preset hole positions (circular, square, or irregular).advantage1. The overall automation level of the equipment is high, with low power consumption and simple operation.2. Laser technology, due to its non-contact processing characteristics, allows for unrestricted processing of graphics and can complete processes that traditional methods cannot achieve.3. Consumable free processing, low operating costs, and more environmentally friendly.4. High precision, small edge breakage, and no secondary damage to the workpiece.  Principles and advantages of laser etching and markingHow is laser etching and marking achieved?The laser focuses a low-power laser with high beam quality on a very small light spot, forming a high power density at the focus, causing the material to evaporate instantly to achieve target area marking.Advantage1. The equipment occupies a small area, is easy to operate, and is flexible to use.2. The range of materials that can be processed is wide (various hard materials, ITO, PET film layers, etc.), and the processing graphics are not limited.3. Consumable free processing, low operating costs, and more environmentally friendly.4. High precision and fast speed.LaserparametersLaser typepicosecondfemtosecondwavelength355+0.5nm1064+0.5nm343nm1030nmaverage output power≤60W≤80W20W≤60Wpulse width~5ps