UV Laser Cutting Engraving Machine

Basic Info.Model NO.JG16ApplicationHome Appliance, Environmental Equipment, Petroleum Machinery Manufacturing, Agriculture Machinery, Textile Machinery, Food Machinery, Aerospace Industry, Automotive Industry, Shoemaking Industry, Woodwork Industry, Advertising IndustryCooling SystemAir CoolingTechnical ClassContinuous Wave LaserApplicable MaterialFPC PCB Cover LayerStructure TypeDesktopLaser ClassificationFree Electron LaserLaser TechnologyLaser Vapor CuttingType for Cutting MachineCNC Cutting MachineCertificationSGS, Ce, RoHS, ISO 9001:2000AutomationAutomaticType for Pipe and Tube Bending MachineElectric Hydraulic Pipe BenderConditionNewTrademarkASIDATransport PackageWooden CartonSpecificationCE, ROHS, ISO9000OriginChina GuangdongHS Code8456100090Product Description                  High Quality Cutting Machine for PCB and FPC1. Usage Precisive cutting of FPC and organic membrane covering board without molds or the protection plate. High-energy laser source and precise control of laser beams can improve the processing speed and the accuracy of processing results. It has all the functions same as the one produced by LPKF but price is lower. 2. Characteristic 2.1. Independent intellectual property rights of the control software, Humanized interface, complete functions and simple operation. 2.2. Processing any graphic, cutting different thickness and different materials, stratified processing and complete synchronously 2.3. Adopt high-performance ultraviolet light laser with short wave length, high beam quality and higher peak power properties. Because ultraviolet light is through decomposition, vaporization instead of melting to cutting the materials, so almost no burrs after processing, small thermal effect, no stratification, precise cutting effects, smooth, steep sidewall. 2.4. Fixed sample by using Vacuum mode, without matrix protection plate, convenient and improving the processing efficiency. 2.5. Used for a variety of substrate materials cutting, such as: Silicon, ceramics, glass, etc. 2.6. Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.3.SpecificationsItem SpecificationMODELJG18Laser Source355nm All-solid-state UV laser cutting device,wavelength 355nmLaser Power10WMaximum Processing Size,720mm×540 mm(21″×28″)XY Platform Maximum Operating Speed50m/minPositioning accuracy±3µmRepeat accuracy±1µmSystem Processing Precision±20µmGalvanometer scanning range50mm X 50mm Cutting Thickness≤1mmPowerAC 220V/50Hz/2.2KW;380V/50Hz/5.5KWVacuum Requirements516m3/hOverall Dimensions1818mm×2317 mm×1550 mmWeight3500kgEnvironmental Temperature20ºC±1ºCHumidity