ABIS PCBA Projects IntroductionABIS CIRCUITS Company deliver
services, not only products. We offer solutions, not only
goods.From the PCB production, the components purchasing to the
components assemble. Includes: PCB CustomPCB drawing /
design according to your schematic diagramPCB
manufacturingComponent sourcingPCB AssemblePCBA 100%
test PCBA Capabilities PCBA Capabilities
1SMT assembly including BGA assembly2Accepted SMD chips: 0204, BGA,
QFP, QFN, TSOP3Component height: 0.2-25mm4Min packing: 02045Min
distance among BGA : 0.25-2.0mm6Min BGA size: 0.1-0.63mm7Min QFP
space: 0.35mm8Min assembly size: (X*Y): 50*30mm9Max assembly size:
(X*Y): 350*550mm10Pick-placement precision: ±0.01mm11Placement
capability: 0805, 0603, 040212High pin count press fit
available13SMT capacity per day: 80,000 points--Capability -
SMT Lines 9(5 Yamaha,4KME)Capacity52 million placements
per monthMax Board Size 457*356mm.(18"X14")Min
Component size 0201-54 sq.mm.(0.084 sq.inch),long
connector,CSP,BGA,QFPSpeed 0.15 sec/chip,0.7
sec/QFP-Capability - PTH Lines2Max board width400
mmType Dual wavePbs status Lead-free line
supportMax temp 399 degree CSpray flux
add-onPre-heat 3Production ProcessesMaterial
Receiving → IQC → Stock → Material to SMT → SMT Line Loading →
Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual
Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling →
SMT Stock → Material to PTH → PTH Line Loading → Plated Through
Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC
Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test
(FCT) → Packing → OQC Sampling → Shipping Our AdvantagesOur
AdvantagesHigh-end euipment-high speed Pick and Place Machines that
can process about 25,000 SMD components per hourHigh efficient
supply ability 60K Sqm monthly-Offers low volume and on-demand PCB
production, also large-scale productionProfessional engineering
team-40 engineers and their own tooling house, strong at
OEM. Offers two easy options: Custom and Standard-In-depth
knowledge of IPC Class II and III StandardsWe provide a
comprehensive turn-key EMS service to customers who want us to
assemble the PCB into PCBA, including prototypes, NPI project,
small and medium volume. We are also able to source all components
for your PCB assembly project. Our engineers and sourcing team have
rich experience in supply chain and EMS industry, with deep
knowledges in SMT assembly allowing to resolve all the production
issues. Our service is cost-effective, flexible, and reliable. We
have satisfied customers across many industries including medical,
industrial, automotive and consumer electronics.Quality
ControlQuality Control-Advanced equipment LISTAOI TestingChecks for
solder pasteChecks for components down to 0201Checks for missing
components, offset, incorrect parts, polarityX-Ray InspectionX-Ray
provides high-resolution inspection of:BGAs/Micro BGAs/Chip scale
packages /Bare boardsIn-Circuit TestingIn-Circuit Testing is
commonly used in conjunction with AOI minimizing functional defects
caused by component problems.Power-up TestAdvanced Function
TestFlash Device ProgrammingFunctional testing IOC incoming
inspectionSPI solder paste inspectionOnline AOI inspectionSMT first
article inspectionExternal
assessmentX-RAY-welding inspectionBGA device reworkQA
inspectionAnti-static warehousing and shipment-Persue 0% complaint
on qualityAll department implements according to ISO and the
related dept has to provide 8D report if any board scrapped to
defective.All the outgoing boards have to be 100% electronic
tested, impedance tested and soldering.Visual inspected, we make
the inspect microsection before shipment.Train the mindset of
employees and our enterprise culture, make they happy with their
work and our company, it's helpful for them to produce good quality
products.High quality raw material (Shengyi FR4, ITEQ, Taiyo Solder
Mask Ink etc.)The AOI could inspect the whole set, boards are
inspected after each process PCB Technical & Capability
Production capacity of hot-sale productsDouble
Side/Multilayer PCB WorkshopAluminum PCB WorkshopTechnical
CapabilityTechnical CapabilityRaw materials: CEM-1, CEM-3,
FR-4(High TG), Rogers, TELFONRaw materials: Alurminum base, Copper
baseLayer: 1 layer to 32 LayersLayer: 1 layer and 2 LayersMin.line
width/space: 3mil/3mil(0.075mm/0.075mm)Min.line width/space:
4mil/4mil(0.1mm/0.1mm)Min.Hole size: 0.1mm(dirilling hole)Min.Hole
size: 12mil(0.3mm)Max. Board size: 1200mm* 600mmMax.Board size:
1200mm* 560mm(47in* 22in)Finished board thickness: 0.2mm-
6.0mmFinished board thickness: 0.3~ 5mmCopper foil thickness:
18um~280um(0.5oz~8oz)Copper foil thickness: 35um~210um(1oz~6oz)NPTH
Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mmHole
position tolerance: +/-0.05mmOutline Tolerance: +/-0.13mmRouting
outline tolerance: +/ 0.15mm; punching outline tolerance:+/
0.1mmSurface finished: Lead free HASL, immersion gold(ENIG),
immersion silver, OSP, gold plati
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