PCB Parameters: PCB SIZE170 x 64
BOARD TYPEDouble sided PCBNumber of Layers2 layersSurface Mount ComponentsYESThrough Hole ComponentsnoLAYER STACKUPcopper ------- 18um(0.5oz)+plate TOP layerFR-4 0.7 mmcopper ------- 18um(0.5oz)+plate BOT layerTECHNOLOGY Minimum Trace and Space:15 mil / 6.5 milMinimum / Maximum Holes:0.3 mm / 3.5 mmNumber of Different Holes:2Number of Drill Holes:35Number of Milled Slots:5Number of Internal Cutouts:0Impedance Control:noNumber of Gold finger:0BOARD MATERIAL Glass Epoxy: FR-4 Tg150ºC, er
Quality PCB Assembly 6 Layer 3oz High Density Interconnect Multilayer HDI PCB Circuit Board products, provide good price PCB Assembly 6 Layer 3oz High Density Interconnect Multilayer HDI PCB Circuit Board from Fastline Circuits Co., Limited.
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