Hard Gold PCB Multilayer Printed Circuit Board with Blind and Buried Vias

Hard Gold PCB Multilayer Printed Circuit Board with Blind and Buried Vias1. Single, Double side & Multi-layer PCB.2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole.3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, gold plating/finger, Peelable mask, Carbon ink.4. Printed Circuit Boards adhere to IPC Class 2 & 3 international PCB standards.5. Quantities range from prototype to medium&big batch production.6.100% E-Test.Technical & CapabilityItemProduction CapacityLayer Counts1-20 layersMaterialFR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc.Board thickness0.20mm-8.00mmMaximum Size600mmX1200mmBoard Outline Tolerance +0.10mmThickness Tolerance(t≥0.8mm)±8%Thickness Tolerance(t