High Quality Immersion Gold PCB Board

Technical CapabilitiesItemsSpeci.RemarkMax panel size32" x 20.5"(800mm x 520mm) Max. Board size2000×610mm Min. board Thickness2-layer 0.15mm 4-layer 0.4mm 6-layer 0.6mm 8-layer 1.5mm 10-layer 1.6~2.0mm Min. line Width/Space0.1mm(4mil) Max. Copper thickness10OZ Min. S/M Pitch0.1mm(4mil) Min. hole size0.2mm(8mil) Hole dia. Tolerance (PTH)±0.05mm(2mil) Hole dia. Tolerance,+0/-0.05mm(2mil) Hole position deviation±0.05mm(2mil) Outline tolerance±0.10mm(4mil) Twist & Bent0.75% Insulation Resistance>10 12 Ω Normal Electric strength>1.3kv/mm S/M abrasion>6H Thermal stress288°C 10Sec Test Voltage50-300V Min. blind/buried via0.15mm (6mil) Surface FinishedHASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold MaterialsFR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) Min PAD (inner layer)5 mil(0.13mm)hole ring widthMin thickness(inner layer)4 mil(0.1mm)without copperInner copper thickness1~4 oz Outer copper thickness0.5~6 oz Finished board thickness0.4-3.2 mm Board thickness tolerance control±0.10 mm±0.10 mm1~4 L±10%±10%6~8 L±10%±10%≥10 LInner layer treatmentbrown oxidation Layer count Capability1-30 LAYER alignment between ML±2mil Min drilling0.15 mm Min finished hole0.1 mm High Quality PCB for Factory High quality immersion gold pcb board: 1. We have 10 years experience in Printed Circuit Board field to serve your needs 2. Competitive price with high quality service-24 hours online service 3. Prompt delivery reable factory 4. Our Printed Circuit Board get ISO and UL Certificates and meet ROHS standard NO ITEM Technical capabilities 1 Layers 1-20 layers 2 Max. Board size 2000×610mm 3 Min. board Thickness 2-layer  0.25mm 4-layer  0.6mm 6-layer  0.8mm 8-layer  1.5mm 10-layer  1.6~2.0mm 4 Min. line Width/Space 0.1mm(4mil) 5 Max. Copper thickness 10OZ 6 Min. S/M Pitch 0.15mm(4mil) 7 Min. hole size 0.2mm(8mil) 8 Hole dia. Tolerance (PTH) ±0.05mm(2mil) 9 Hole dia. Tolerance (NPTH) +0/-0.05mm(2mil) 10 Hole position deviation ±0.05mm(2mil) 11 Outline tolerance ±0.10mm(4mil) 12 Twist & Bent 0.75% 13 Insulation Resistance >10 12 Ω Normal 14 Electric strength >1.3kv/mm 15 S/M abrasion >6H 16 Thermal stress 288°C 10Sec 17 Test Voltage 50-300V 18 Min. blind/buried via 0.15mm  (6mil) 19 Surface Finished LF HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold 20 Materials FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base /* January 22, 2024 19:08:37 */!function(){function s(e,r){var a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1