Multilayer PCB Board Printed Circuit Board Fabrication PCB Electonics Manufacturer

Basic Info.Model NO.Rigid PCBTypeRigid Circuit BoardDielectricFr-4MaterialFiberglass EpoxyApplicationComputerFlame Retardant PropertiesV0Mechanical RigidRigidProcessing TechnologyElectrolytic FoilBase MaterialCopperInsulation MaterialsEpoxy ResinSpecification2L-32LProduct DescriptionCIRCUITS (Design for manufacturing capability)-RigidItemNamelimit capability(sample)limit capability(small-medium volume)1MaterialNormal FR-4Brand: KingBoard, ShengYi, ITEQBrand: KingBoard, ShengYi, ITEQ2Special materialNormal Tg, FR-4(HF), High Tg FR-4(HF), High Tg FR-4, PTFE, CeramicNormal Tg, FR-4(HF), High Tg FR-4(HF), High Tg FR-4, PTFE, Ceramic3TypeRigid PCBMulti-blind&Buried, thick copper, Via in Pad(copper filled, resin filled), Resin filled(not via in pad), Gold fingers without tie bar, hard gold plated, Edge plated.Multi-blind&Buried, thick copper, Via in Pad(resin filled), Resin filled(not via in pad), Gold fingers without tie bar, hard gold plated, Edge plated.4Lay upBlind&Buriedlamination≤3timeslamination≤2times5SurfaceFinishLead-freeLead-free with HASL,Electroplated gold(Substrate thickness≤2OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,ENIG+OSP,ENIG+Gold finger,Electroplated gold+Gold finger,Immersion Sliver+Gold finger,Immersion Tin+Gold finger,ENEPIGLead-free with HASL,Electroplated gold(Substrate thickness≤1OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,ENIG+OSP,ENIG+Gold finger,Electroplated gold+Gold finger,Immersion Sliver+Gold finger,Immersion Tin+Gold finger,ENEPIG6LeadedLead with HASLLead with HASL7Plating/coatingthicknessHASL2-40UM(0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)2-40UM(0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)8Electroplated goldNi:3-5UM;Au;0.025-0.1UMNi:3-5UM;Au;0.025-0.1UM9ENIGNi:3-5UM;Au;0.025-0.1UMNi:3-5UM;Au;0.025-0.1UM10Immersion Tin≥1.0UM≥1.0UM11Immersion Sliver0.1-0.3UM0.1-0.3UM12OSP0.2-0.3UM0.2-0.3UM13Hard Gold≤1.25UM≤1.25UM14ENEPIGNi:3-5UM;Pd:0.05-0.1UM;Au;0.025-0.1UMNi:3-5UM;Pd:0.05-0.1UM;Au;0.025-0.1UM15Carbon Ink0.1-0.35UM0.1-0.35UM16Soldermask15-25UM(on copper area),8-12UM(on via pad and on circuits around the corner)(just for one-time print and copper thickness10mil)43Width/SpaceInternal Layer(Substrate) 1/3OZ,1/2OZ        3.5/3.5mil 1/3OZ,1/2OZ        4/4mil441OZ                  3/4mil1OZ                  3/4mil452OZ                  5/6mil2OZ                  5/6mil463OZ                  6/7mil3OZ                  7/9mil474OZ                  8/11mil4OZ                  9/12mil485OZ                  10/16mil5OZ                    /49External Layer(Substrate)1/3OZ                3.5/3.5mil1/3OZ                4/4.5mil501/2OZ                3.5/3.5mil1/2OZ                4/4.5mil511OZ                  4.5/5mil1OZ                  5/5.5mil522OZ                  6/8mil2OZ                  6.5/8mil533OZ                  8/12mil3OZ                  8/13mil544OZ                  9/15mil4OZ                  10/16mil555OZ                  11/16mil5OZ                  12/18mil56Width tolerance≤10mil:±1mil≤10mil:±1.5mil57>10mil:±1.5mil>10mil:±2.0mil58SpaceMin gap between hole wall andconductor (None blind and buried via PCB)8mil(1 time laminating),9mil(2 time laminating),10mil(3 time laminating),9mil(1 time laminating),10mil(2 time laminating)596mil(