Multilayer Pcbs, Rigid-Flex High-Density Multilayer PCB Immersion Gold HASL-FL

PCBA Capabilities  1SMT assembly including BGA assembly2Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP3Component height: 0.2-25mm4Min packing: 02045Min distance among BGA : 0.25-2.0mm6Min BGA size: 0.1-0.63mm7Min QFP space: 0.35mm8Min assembly size: (X*Y): 50*30mm9Max assembly size: (X*Y): 350*550mm10Pick-placement precision: ±0.01mm11Placement capability: 0805, 0603, 040212High pin count press fit available13SMT capacity per day: 80,000 points--Capability - SMT  Lines 9(5 Yamaha,4KME)Capacity52 million placements per monthMax Board Size   457*356mm.(18"X14")Min Component size 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFPSpeed 0.15 sec/chip,0.7 sec/QFP-Capability - PTH  Lines2Max board width400 mmType   Dual wavePbs status Lead-free line supportMax temp  399 degree CSpray flux   add-onPre-heat  3Production ProcessesMaterial Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → ShippingOur AdvantagesHigh-end equipment-high speed Pick and Place Machines that can process about 25,000 SMD components per hourHigh efficient supply ability 60K Sqm monthly-Offers low volume and on-demand PCB production, also large-scale productionProfessional engineering team-40 engineers and their own tooling house, strong at OEM. Offers two easy options: Custom and Standard-In-depth knowledge of IPC Class II and III StandardsWe provide a comprehensive turn-key EMS service to customers who want us to assemble the PCB into PCBA, including prototypes, NPI projects, and small and medium volumes. We are also able to source all components for your PCB assembly project. Our engineers and sourcing team have rich experience in the supply chain and EMS industry, with deep knowledge in SMT assembly allowing us to resolve all the production issues. Our service is cost-effective, flexible, and reliable. We have satisfied customers across many industries including medical, industrial, automotive, and consumer electronics.Quality Control-Advanced equipment LISTAOI TestingChecks for solder pasteChecks for components down to 0201Checks for missing components, offset, incorrect parts, polarityX-Ray InspectionX-Ray provides high-resolution inspection of:BGAs/Micro BGAs/Chip scale packages /Bare boardsIn-Circuit TestingIn-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.Power-up TestAdvanced Function TestFlash Device ProgrammingFunctional testing IOC incoming inspectionSPI solder paste inspectionOnline AOI inspectionSMT's first article inspectionExternal assessmentX-RAY-welding inspectionBGA devise reworkQA inspectionAnti-static warehousing and shipment-Persue 0% complaints on the qualityAll department implements according to ISO and the related dept has to provide an 8D report if any board is scrapped to defective.All the outgoing boards have to be 100% electronic tested, impedance tested, and soldering.Visually inspected, we make the inspect microsection before shipment.Train the mindset of employees and our enterprise culture, and make them happy with their work and our company, it's helpful for them to produce good quality products.High-quality raw material (Shengyi FR4, ITEQ, Taiyo Solder Mask Ink, etc.)The AOI could inspect the whole set, boards are inspected after each process  PCB Technical & Capability  Production capacity of hot-sale productsDouble Side/Multilayer PCB WorkshopAluminum PCB WorkshopTechnical CapabilityTechnical CapabilityRaw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFONRaw materials: Aluminum base, Copper baseLayer: 1 layer to 32 LayersLayer: 1 layer and 2 LayersMin.line width/space: 3mil/3mil(0.075mm/0.075mm)Min.line width/space: 4mil/4mil(0.1mm/0.1mm)Min.Hole size: 0.1mm(dirilling hole)Min. Hole size: 12mil(0.3mm)Max. Board size: 1200mm* 600mmMax.Board size: 1200mm* 560mm(47in* 22in)Finished board thickness: 0.2mm- 6.0mmFinished board thickness: 0.3~ 5mmCopper foil thickness: 18um~280um(0.5oz~8oz)Copper foil thickness: 35um~210um(1oz~6oz)NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mmHole position tolerance: +/-0.05mmOutline Tolerance: +/-0.13mmRouting outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mmSurface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK.Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP etcImpedance control tolerance: +/-10%Remain thickness tolerance: +/-0.1mmProduction capability: 50,000 s.q.m/monthMC PCB Production capability: 10,000 s.q.m/month Q/T Lead TimeCategoryQ/T Lead timeStandard Lead TimeMass Production 2 Layers24hrs3-4 working