Specifications:Layers: 8Thickness: 4.0mmMaterial: FR4 S1000-2Size:
110*62mmSurface treatment: Immersion goldLine width/spacing:
3/3milMinimum aperture: 0.25mmSolder mask color: photosensitive
greenFinished copper thickness: inner layer 1 OZ, outer layer 1
OZFeatures:1. The integration of the board design is very high, the
thickness-to-diameter ratio exceeds 10:1, and the difficulty of
electroplating of copper is high.2. Made of TG170 materialShenzhen
XMD Circuits Co.,Ltd, previously known as Jaleny(jlypcb), was
founded in 2009 and started the journey of circuit board in
Shenzhen,China. Through the introduction of advanced production and
testing equipment and technical exchanges with factories in the
same industry and engineering colleges, XMD greatly expanded the
process capacity of double-sided board and multi-layer board. In
2011, we began to explore overseas markets and export foreign
orders to all parts of the world. In 2018, Jiangxi Ji'an added a
new production line, mainly making batch orders.Able to produce
50,000 sqm of PCBs monthlyOne-stop solutions for clients (PCB &
PCBA)Over 12 years of Experience in PCBsAvg Response time: ≤24 h
(experienced Engineers to Serve you)Comply with
RoHS,TS16949,ISO9001 and UL certifications.Flexibilities in
Shipment Arrangement (FOB HK or Shenzhen by sea or by air, CIF via
DHL,Fedex,UPS or TNT etc.) A professional team, using
automation, digitization to greatly improve pcb production
efficiency and reduce PCB procurement costs.High-quality Raw
Material★Traceable source of branded raw material★Standardized
procurement process★Strict supplier selection policyProduction
Equipment★High precision processing equipment★Efficient operation
guarantees quality★Meet various special technical
processesIntelligent System★Intelligent audition★Intelligent
CAM★Intelligent paneling★Intelligent productionStrict
Inspection★100% AOI testing★100% FQA/FQC★Quality Control★'Failed
One Lost Ten' Our Capabilities and
TechnologyItems20222023Layers(MP):22layer,(Sampling):32
layer(MP):32layerMax. Board THKSampling 4.0mm / MP :3.2mmSampling
5.0mm / MP:3.2mmMin. Board THKSampling :0.4mm /MP :0.5mmSampling:
0.3mm / MP:0.4mmBase copperInner layer1/3 ~ 6OZ1/3~8 OZOuter
layer1/3 ~ 6 OZ1/3 ~ 8 OZBorehole diameterMin.PTH0.2mm0.15mmMax.
aspect ratio10:0112:01HDI aspect ratio0.8:11:01Tolerances
PTH±0.076mm±0.05mm NPTH±0.05mm±0.03mmSolder mask
opening0.05mm0.03mmSolder dam(Green) 0.076mm ,(Green) 0.076mm
,(other color) 0.1mm(other color) 0.08mmMin. core
THK.0.1mm0.08mmBow&twist≤0.5%≤0.5%Routing Tol. Sampling
:±0.075mm /MP:±0.1mmSampling:±0.075mm /MP:±0.075mmImpedance
Tol.±10%±8%Min. w/s (Inner layer)0.075 / 0.075mm0.075 / 0.075mmMin.
w/s (Outer layer)0.075 / 0.075mm0.075 / 0.075mm (Min. BGA
size)0.2mm0.15mm(pitch)(Min. BGA Pitch)0.65mm0.5mm(Working panel
size)600mm*700mm600mm*700mmSpecial processSplit gold fingers,
Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling
Blind hole. /* January 22, 2024 19:08:37
*/!function(){function s(e,r){var
a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1
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