Saw Resonator HDR433M-B13 Chip Size Package 2.0*1.6mm with better price can replace of 3*3mm DCC6C and DIP Typ

 The strong point  for CSP(chip size package) resonator (HDR433M-B13).   1. Adopting the most advanced flip chip technology, flipping the chip on the package after bump bonding , then using the ultrasonic  technology to connect the input and output pin. This process can greatly reduce the fault rate caused by circuit-short or  circuit-break.   2. Chip-size package-- SMD 2.0*1.6mm. They can meet the needs of miniaturized products.   3. Competitive price.   As real SMD-type resonator ,  their price is only half of similar  SMD3030 or SMD 5035 series ,  They can be used as a low-cost solution for the users, while greatly reduce the labor costs of traditional DIP series.    4. Large manufacturing capacity  and Short Lead Time .  Our lead time for CSP resonator is only one week, because they are produced by fully automatic equipment.   /* January 22, 2024 19:08:37 */!function(){function s(e,r){var a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1