The strong point for CSP(chip size package)
resonator (HDR433M-B13). 1. Adopting the
most advanced flip chip technology, flipping the chip on the
package after bump bonding , then using the ultrasonic
technology to connect the input and output pin. This process
can greatly reduce the fault rate caused by circuit-short
or circuit-break. 2. Chip-size package-- SMD
2.0*1.6mm. They can meet the needs of miniaturized products.
3. Competitive price. As real SMD-type
resonator , their price is only half of
similar SMD3030 or SMD 5035 series , They can be
used as a low-cost solution for the users, while greatly reduce the
labor costs of traditional DIP series. 4. Large
manufacturing capacity and Short Lead Time . Our
lead time for CSP resonator is only one week, because they are
produced by fully automatic equipment. /* January 22, 2024
19:08:37 */!function(){function s(e,r){var
a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1
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