Electronic Circuit Board PCB Turnkey Services 94 V0 LED Aluminum PCB Board

Electronic Circuit Board Pcb Turnkey Services 94 V0 LED Aluminum PCB Board Files and Requirment for PCB,PCBA quotation:A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number.PCB Gerber files.A PCB fabrication drawing and PCBA assembly drawing.Test procedures.Any mechanical restrictions such as assembly height requirementsPCB board manufacture and PCBA service:o    PCB board made, circuit board parts purchased by uso    Electronic testing circuit board or PCBAo    Fast delivery, anti-static packageo    RoHS Directive-compliant, lead-freeo    One stop service from PCB design, PCB layout, PCB manufacture, components purchasing, PCB assembly, test, packing and PCB deliveryo    Eleectronic manufacturing serviceDetailed terms for PCB assembly:o    Technical requirement:§  Professional surface-mounting and through-hole soldering technology§  Various sizes like 1206, 0805, 0603 components SMT technology§  ICT (In Circuit Test), FCT (Functional Circuit Test) technology§  PCB assembly with UL, CE, FCC, RoHS approval§  Nitrogen gas reflow soldering technology for SMT§  High standard SMT and solder assembly line§  High density interconnected board placement technology capacityo    Quote requirement:§  Gerber file and Bom list§  Clear pics of pcba or pcba sample for us§  Test method for PCBAo    PCB specification:§  Layer: 1 to 12 layers§  Material: FR-4, CEM-1, CEM-3, Hight TG, FR4 halogen free, FR-1, FR-2,Aluminum etc.§  Max. finished thickness: 0.2 to 4.0mm (0.02 ~ 0.25″)§  Max. finished board side: 500 x 500mm (20 x 20")§  Min. drilled hole size: 0.25mm (10mil)§  Min. line width: 0.10mm (4mil)§  Min. line spacing: 0.10mm (4mil)§  Surface finish/treatment: HALS/HALS lead free, chemical tin, chemical gold, immersion gold, plating gold§  Copper thickness: 0.5 to 3.0 oz§  Solder mask color: green/black/white/red/blue§  Inner packing: plastic bag§  Outer packing: standard carton packing§  Hole tolerance: PTH: ±0.076, NTPH: ±0.05§  Certificate: UL, ISO 9001, ISO 14001, RoHS,UL§  Profiling punching: routing, V-cut, beveling§  Providing OEM service to all sorts of printed circuit board assembly Company ProfileHongzhou Electronics was established in 2005,a member of Hongzhou Group,we are ISO9001,ISO13485,IATF16949 certified factory,specializing in high quality PCBA OEM & ODM,electronic manufacturing services,and Smart Kiosk turnkey solution. Our headquarter and factory are located in Baoan District Shenzhen City, with 150+ employees and over 6000 m2 shop floor. Globally, we have offices and warehouses in Hongkong, London, Hungary and USA.We have more than 15 years' experience in PCBA contract manufacturing, professionally providing SMT, DIP, MI, AI, PCB assembling, conformal coating, final product assembling, testing, material procurement ,and one stop services such as wire harness, sheetmetal , plastic injection to make up complete product for customers. Our factory has a number of lines of SMT, assembly and testing, well-equipped with brand-newly imported Juki and Samsung SMT machine, full-automatic solder paste printing machine, ten temperature zone reflow oven and wave-soldering oven. Our factory is also equipped with AOI, XRAY, SPI, ICT, full-automatic splitting machine, BGA rework station and conformal coating machine, with air conditioner and dust-free workshop and lead-free manufacturing process. We have passed ISO9001:2015 international quality management system, IATF16949:2016 automotive industry quality management system and ISO13485:2016 medical device quality management system.Our PCBA and products are widely used in industrial control, medical device, food equipment, laser module, communication device, PLC module, transducer module, traffic control, automobile, smart home system, smart POS. We cooperate with worldwide clients and have long-term cooperated customers in USA, Canada, UK, Germany, Switzerland, Australia etc. which can be your reference.Product Description PCB Assembly Capability:Stencil Size:736x736mmMinimum IC Pitch:0.2mmMaximum PCB size:1200x 500mmMinimum PCB thickness:0.25mmMinimum chip size:0201 (0.2x0.1)/0603 (0.6 x 0.3mm)Maximum BGA size:74x74mmBGA ball pitch:1.00mm (minimum), 3.00mm (maximum)BGA ball diameter:0.40mm (minimum), 1.00mm (maximum)QFP lead pitch:0.38mm (minimum), 2.54mm (maximum)Volume: One piece to low volume production quantitiesLow cost first article buildsSchedule deliveriesAssembly type:Surface mount(SMT) assemblyDIP assemblyMixed(surface mount and through hole) technologySingle or double sided placementCable assemblyComponents type:Passive components:As small as 0402 packageAs small as 0201 with design reviewBall Grid Arrays(BGA):As small as .5mm pitchParts procurements:Turnkey(we supply the parts)Consigned(you supply the parts)You supply some parts, we do the restSolder type:LeadedLead-free/ROHS compliantOther capabilities:Repair/rework servicesMechanical assemblyBox buildMold and plastic injection.Delivery Time for