Basic Info.Model NO.WEX49Metal Coating Copper Mode of ProductionSMTLayersMultilayerBase Material FR-4 CertificationRoHS, CCC, ISOCustomizedCustomizedConditionNewPCB TypeRigid PCB, Flex PCB, Rigid-Flex PCBProcessing Technology Electrolytic Foil SMD SpeedChip Components

2024-04-07

Basic Info.Model NO.WEX53Metal CoatingCopperMode of ProductionSMTLayersSingle-LayerBase MaterialFR-4CertificationRoHS, CCC, ISOCustomizedCustomizedConditionNewTrack Width/Spacing(Min)3milBoard Thickness1.6mmDrilled Hole Size(Min)0.075mmBase Material Thinckness0.2-3

2024-04-07

Basic Info.Model NO.WEX44Metal CoatingCopperMode of ProductionSMTLayersMultilayerBase MaterialFR-4CertificationRoHS, CCC, ISOCustomizedCustomizedConditionNewSurface FinishHASL, Gold Finger, OSP, Enig, Peelable MaskPCBA QCX-ray,Aoi Test,Function Test(100% Test)Drilled

2024-04-07

Basic Info.Model NO.WEX55Metal Coating Copper Mode of ProductionSMTLayers Multilayer Base Material FR-4 CertificationRoHS, CCC, ISOCustomized Customized Condition New Base Material Thinckness0.2-3.6mmWarpAccording to The Ipc-600f StandardRequired Docs for PCBAGerber

2024-04-07

Basic Info.Model NO.WEX75Metal CoatingAluminumMode of ProductionSMTLayersMultilayerBase MaterialFR-4CertificationRoHS, CCC, ISOCustomizedCustomizedConditionNewBoard Thickness0.2mm-4mmPCB BGA Size8X6mm~55X55mmMin.Line Spacing0.1mm (4 Mil)Required Docs for PCBAGerber File

2024-04-07

Basic Info.Model NO.WEX52Metal Coating Copper Mode of ProductionSMTLayersMultilayerBase Material FR-4 CertificationRoHS, CCC, ISOCustomizedCustomizedConditionNewPCB StandardIpc-a-610 D/Ipc-III StandardLine Width/Spacing3/2.5milPCB TypeRigid PCB, Flex PCB, Rigid-Flex

2024-04-07

Basic Info.Model NO.WEX54Metal CoatingCopperMode of ProductionSMTLayersMultilayerBase MaterialFR-4CertificationRoHS, CCC, ISOCustomizedCustomizedConditionNewSurface FinishHASL, Gold Finger, OSP, Enig, Peelable MaskPCBA QCX-ray,Aoi Test,Function Test(100% Test)Drilled

2024-04-07

Basic Info.Model NO.WEX16Metal CoatingCopperMode of ProductionSMTLayersMultilayerBase MaterialFR-4CertificationRoHS, CCC, ISOCustomizedCustomizedConditionNewSurface FinishingHASL, HASL(Lead Free), Immersion GoldTestingFlying Probe, E-Test, X-ray Inspection , AoiColorCus

2024-04-07

Basic Info.Model NO.WEX-28Metal CoatingCopperMode of ProductionSMTLayersMultilayerBase MaterialFR-4CertificationRoHS, CCC, ISOCustomizedCustomizedConditionNewWrapAccording to The Ipc-600f StandardCopper Thinckness1/2oz 1oz 2oz 3ozSMD SpeedChip Components SMD Speed 0.3s

2024-04-07

Basic Info.Model NO.WEX05Metal CoatingCopperMode of ProductionSMTLayersMultilayerBase MaterialFR-4CertificationRoHS, CCC, ISOCustomizedCustomizedConditionNewAndroid VersionAndroid 9.0ApplicationsIndustrial Grade PDAPowerMain Battery: Li-ion, Rechargeable, 4200mAhBluetoo

2024-04-07